ULTRA® 3SP™si 3SP™ HD

Familia Ultra ® 3SP ™ foloseste tehnologia 3SP ™ (Scan-Spin-Selective Photocure) pentru a imprima rapid 3D piese foarte precise, indiferent de complexitatea geometrica prinind de la de la fisiere STL.

Ultra ® 3SP ™ și 3SP ™ High Definition sunt fiecare livrate si instalate cu toate aplicatiile software-ul relevante (Envisiontec Magics, Perfactory, ultra Control) pentru a permite vorificarea integritatii fisierelor STL, generarea automata a joburilor si productia modelului perfect.

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Calitatea suprafetei de modele imprimate nu prezinta semne de scara pas cu pas pe suprafetele interioare si exterioare. Fiabilitatea sursei de lumina de imagistica si productivitatea de mare viteza este cea mai competitiva imprimanta 3D de pe piata de astazi.

 

Beneficii:3SPD3-300x228

– Interfata de utilizator simpla cu built-in ecran tactil
– Foarte putine piese in miscare si componentele minime consumabile garanteaza un sistem puternic si de incredere
– Cel mai mic cost de exploatare din clasa sa
– Componente low cost parte din cauza deseurilor de material minim
– Permite operarea in birou, construit cu un ecran tactil
– Notificare de la distanta atunci cand operatiunea de procesare este completa.

Caracteristici:

Utilizing a built in Ethernet interface, the ULTRA® 3SP™ can easily connect directly to a PC workstation or be integrated into a network. The ULTRA® 3SP™ has an embedded PC, allowing the system to work independently from the pre-processing workstation. The machine can be remotely monitored from any computer on the network using the communication software from the ULTRA® Software Suite. Any STL data format can be easily imported using the ULTRA® Software Suite.

  • Footprint (L x W x H): 29” x 30” x 46” (74 x 76 x 117 cm)
  • Optional Stand (L x W x H): 29″ x 30″ x 25″ (74 x 76 x 64 cm)
  • Weight: 198 lbs (90 kg)
  • Electrical Requirements: 100-127 VAC, 50/60 Hz, single phase, 8A
    200-240 VAC, 50 Hz, single phase, 4A
  • Data Handling – STL
  • Warranty – 1 year included on machine
  • Build envelope XYZ: 10.5” x 7” x 7.6” (266 x 177.8 x 193 mm)
  • ULTRA® 3SP™ Resolution in X and Y: 0.004″ (100 µm)
  • ULTRA® 3SP™ HD Resolution in X and Y: 0.002″ (50 µm)
  • Dynamic Voxel Resolution in Z*: 0.001″ – 0.004″ (25 – 100 µm) – user adjustable
  • E-Denstone: General purpose, high temperature molding, concept models
  • ABS 3SP™ White: Fast-growing, tough material with similar characteristics to ABS plastic.
  • E-Glass: Transparent material

Ce poate face pentru dumneavoastra aceasta tehnologie ? Ne gasiti la: 0722.224.686 sau 0771.674.221.

download DESCARCA MANUALUL ULTRA 3SP si 3SP HD

 

 

 

 

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